PS9601L(2001) データシートの表示（PDF） - NEC => Renesas Technology

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PS9601L
(Rev.:2001)

HIGH ISOLATION VOLTAGE HIGH SPEED PHOTOCOUPLER

NEC => Renesas Technology 

RECOMMENDED SOLDERING CONDITIONS

(1) Precautions in mounting the devices by infrared reflow soldering

• Peak reflow temperature

235 ˚C or below (plastic surface temperature)

• Reflow time

30 seconds or less (Time period during which the plastic surface temperature

is 210 ˚C

• Number of reflows Processes

One

• Flux

Rosin flux containing small amount of chlorine (The flux

with a max. chlorine content of 0.2 Wt % is recommended.)

INFRARED RAY REFLOW TEMPERATURE PROFILE

PS9601, PS9601L

120 to 160 ßC

60 to 120 s

(pre-heat)

(Actual heat)

to 10 s

to 30 s

235 ßC Peak

210 ßC

Time (s)

Peak Temperature 230 ºC

or Lower

(2) Precautions in mounting the devices in solder dip method

• Temperature

260 ˚C or below

• Time

10 seconds or less

• Flux

Rosin group flux, where the amount of chloride component is small.

EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM

DATA SUBJECT TO CHANGE WITHOUT NOTICE

08/06/2001

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