4.2. PAD Locations
Preliminary
GPDS207A/GPDS208A
This IC substrate should be connected to VSS
Note1: To ensure that the IC functions properly, please bond all of VDD and VSS pins.
Note2: The 0.1μF capacitor between VDD and VSS should be placed to IC as close as possible.
© Generalplus Technology Inc.
7
Proprietary & Confidential
MAY 14, 2009
Preliminary Version: 0.1