ADNS-2030 データシートの表示（PDF） - Avago Technologies

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ADNS-2030

Low Power Optical Mouse Sensor

Avago Technologies 

SCLK

SERIAL

PORT

SDIO

XA

XB

QUADRA TURE

OUTPUTS

YA

YB

R_BIN

LED

XY_LED

SERIAL PORT

OSCILLA TOR

POWER ON

RESET

LED

DRIVE

IMAGE

PROCESSOR

OSC_IN

OSC_OUT

RESONA TOR

PD

V DD

3.3 VOL T

GND

POWER

GND

REF A

VOL TAGE

REFERENCE

REFB

Figure 6. Block diagram of ADNS-2030 optical mouse sensor.

PCB Assembly Considerations

1. Insert the sensor and all other electrical components

into PCB.

2. Bend the LED leads 90° and then insert the LED into

the assembly clip until the snap feature locks the LED

base.

3. Insert the LED/clip assembly into PCB.

4. Wave Solder the entire ­assembly in a no-wash solder

process utilizing solder fixture. The solder fixture

is needed to protect the sensor during the solder

process. The fixture should be designed to expose

the sensor leads to solder while shielding the optical

aperture from direct solder contact. The solder fixture

is also used to set the reference height of the sensor

to the PCB top during wave soldering (Note: DO NOT

remove the kapton tape during wave soldering).

5. Place the lens onto the base plate.

6. Remove the protective kapton tape from optical

aperture of the sensor. Care must be taken to keep

contaminants from entering the aperture. It is recom-

mended not to place the PCB facing up during the

entire mouse assembly process. The PCB should be

held vertically during the kapton removal process.

7. Insert PCB assembly over the lens onto the base plate

aligning post. The sensor aperture ring should self-

align to the lens.

8. The optical position reference for the PCB is set by the

base plate and lens. Note that the PCB motion due to

button presses must be minimized to maintain optical

alignment.

9. Install mouse top case. There must be a feature in

the top case to press down onto the clip to ensure

all components are interlocked to the correct vertical

height.

Design Considerations for Improving ESD Performance

The flange on the lens has been designed to increase

the creepage and clearance distance for electrostatic

discharge. The table below shows typical values assum-

ing base plate construction per the Avago supplied IGES

file and HDNS-2100 lens flange.

Typical Distance

Creepage

Clearance

Millimeters

16.0

2.1

For improved ESD performance, the lens flange can be

sealed (i.e. glued) to the base plate. Note that the lens

material is polycarbonate and therefore, cyanoacrylate

based adhesives or other adhesives that may damage the

lens should NOT be used.

Sensor

Clip

PCB

LED

Lens/Light Pipe

Base Plate

Surface

Figure 7. PCB assembly.



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