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MMBD3004 データシートの表示(PDF) - TSC Corporation

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MMBD3004
TSC
TSC Corporation TSC
MMBD3004 Datasheet PDF : 4 Pages
1 2 3 4
Small Signal Product
MMBD3004/CA/CC/SE
Taiwan Semiconductor
350mW, SMD Switching Diode
FEATURES
- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
MECHANICAL DATA
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Weight: 8 ± 0.5 mg
SOT-23
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
Power Dissipation
PD
350
Repetitive Peak Reverse Voltage
VRRM
350
Repetitive Peak Forward Current
IFRM
625
Mean Forward Current
IO
225
Non-Repetitive Peak Forward
Surge Current
Pulse Width=1μs
Pulse Width=1s
IFSM
4
1
Thermal Resistance (Junction to Ambient)
Junction and Storage Temperature Range
RθJA
TJ , TSTG
357
-65 to +150
PARAMETER
Reverse Breakdown Voltage
IR=100μA
Forward Voltage
IF=100mA
IF=200mA
Reverse Leakage Current
Junction Capacitance
VR=240V
VR=240V,
VR=1V,
TJ=150oC
f=1.0MHz
Reverse Recovery Time
IF=IR=30mA, RL=100, IRR=0.1IR
SYMBOL
V(BR)
VF
IR
CJ
trr
MIN
350
-
-
-
-
-
-
MAX
-
1.00
1.25
0.1
100
5
50
UNIT
mW
V
mA
mA
A
oC/W
oC
UNIT
V
V
μA
pF
ns
Document Number: DS_S1501010
Version: B15

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