FAN4860 データシートの表示（PDF） - ON Semiconductor
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FAN4860 Datasheet PDF : 21 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
VIN
VOUT
VFB
VSW
VIN Pin
VOUT Pin
FB Pin
SW Node
DC
Transient: 10 ns, 3 MHz
VEN
ESD
EN Pin
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
TJ
TSTG
TL
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Min.
-0.3
–2
–2
-0.3
-1.0
-0.3
–40
–65
Max.
5.5
6
6
5.5
6.5
5.5
2
1
+150
+150
+260
Units
V
V
V
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
VIN Supply Voltage
IOUT Output Current
TA Ambient Temperature
TJ
Junction Temperature
Parameter
5.4 VOUT
5.0 VOUT
3.3 VOUT
Min.
2.3
2.3
2.3
–40
–40
Max.
4.5
4.5
3.2
200
+85
+125
Units
V
mA
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
TJ(max) at a given ambient temperate TA.
Symbol
Parameter
WLCSP
JA
Junction-to-Ambient Thermal Resistance
UMLP
Typical
130
57
Units
°C/W
°C/W
© 2010 Fairchild Semiconductor Corporation
FAN4860 • Rev. 1.1.1
3
www.fairchildsemi.com
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