Product Datasheet
TGA1073C-SCC
1µF Cap on
Supply Line
RF In
VG
0.01µF
100pF
100pF
100pF
100pF
0.01µF
VD
Chip Assembly and Bonding Diagram
RF Out
1µF Cap on
Supply Line
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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