TGA2567-SM データシートの表示（PDF） - TriQuint Semiconductor
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TGA2567-SM Datasheet PDF : 11 Pages
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Mechanical Information
All dimensions are in inches. Unless specified otherwise, tolerances: ± 0.127 in.
TGA2567-SM
2-20 GHz LNA Amplifier
Marking: Part number – 2567
Year/Month code – YYMM
Batch ID – MXXX
PCB Mounting Pattern
Package Materials:
Base Aluminum Nitride (AIN)
Lid Liquid Crystal Polymer (LCP)
Part is EPOXY Sealed
Land Pads are Gold Plated
The pad pattern shown above has been developed and tested for optimized assembly at TriQuint. The PCB land
pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from
company to company, careful process development is recommended.
Ground / thermal vias are critical for the proper performance of this device. Vias should use a 0.008 in. diameter drill,
and they are solid filled, copper plated shut.
Preliminary Datasheet: Rev - 06-21-13
© 2013 TriQuint
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Disclaimer: Subject to change without notice
www.triquint.com
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