AQV210HL データシートの表示（PDF） - Matsushita Electric Works

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AQV210HL

GU (General Use) Type 1-Channel (Form A) Current Limit Function 6-Pin Type PhotoMOS RELAYS

Matsushita Electric Works 

AQV210HL

8. Soldering

1) When soldering PC board terminals,

keep soldering time to within 10 s at

260°C 500°F.

(1) IR (Infrared reflow) soldering method

T3

T2

T1

2) When soldering surface-mount termi-

nals, the following conditions are recom-

mended.

(2) Vapor phase soldering method

T2

T1

(3) Double wave soldering method

T2

T1

t1

t2

T1 = 155 to 165°C 311 to 329°F

T2 = 180°C 200°C 356 to 392°F

T3 = 245°C 473°F or less

t1 = 120 s or less

t2 = 30 s or less

(4) Soldering iron method

Tip temperature: 280 to 300°C 536 to

572°F

Wattage: 30 to 60 W

Soldering time: within 5 s

t1

t2

T1 = 180 to 200°C 366 to 392°F

T2 = 215°C 419°F or less

t1 = 40 s

t2 = 90 s or less (40 s or less for SOP type)

t1

t2 t3

T1 = 155 to 165°C 311 to 329°F

T2 = 260°C 500°F or less

t1 = 60 s or less

t2+t3 = 5 s or less

(5) Others

Check mounting conditions before using

other soldering methods (hot-air, hot

plate, pulse heater, etc.)

• The temperature profile indicates the

temperature of the soldered terminal on

the surface of the PC board.

The ambient temperature may increase

excessively. Check the temperature under

mounting conditions.

• The conditions for the infrared reflow sol-

dering apply when preheating using the

VPS method.

9. The following shows the packaging format

1) Tape and reel

Type

Tape dimensions

Dimensions of paper tape reel

6-pin SMD

type

0.4±0.05

.016±.002

Tractor feed holes

1.5

+0.1

–0

dia.

.059

+.004

–0

dia.

Direction of picking

10.1±0.1

.400±.004

1.75±0.1

.069±.004

Device mounted

on tape

7.5±0.1

.295±.004

16±0.3

.630±.012

4.5±0.3

.177±.012

12±0.1

4±0.1

.472±.0042±0.1 .157±.004

9.2±0.1

.362±.004

1.6±0.1 dia.

.079±.004

.063±.004 dia.

(1) When picked from 1/2/3-pin side: Part No. AQVrrrAX (Shown above)

(2) When picked from 4/5/6-pin side: Part No. AQVrrrAZ

2±0.5

.079±.020

21±0.8

.827±.031

80±1 dia.

3.150±.039 dia.

300±2 dia.

11.811±.079 dia.

80±1 dia.

3.150±.039 dia.

13±0.5 dia.

.512±.020 dia.

17.5±2.0

.689±.079

2±0.5

.079±.020

2) Tube

Devices are packaged in a tube so pin No.

1 is on the stopper B side. Observe cor-

rect orientation when mounting them on

PC boards.

(DIP, SMD type)

StopperB

StopperA

10. Transportation and storage

1) Extreme vibration during transport will

warp the lead or damage the relay. Han-

dle the outer and inner boxes with care.

2) Storage under extreme conditions will

cause soldering degradation, external ap-

pearance defects, and deterioration of the

characteristics. The following storage

conditions are recommended:

• Temperature: 0 to 45°C 32 to 113°F

• Humidity: Less than 70% R.H.

• Atomosphere: No harmful gasses such

as sulfurous acid gas, minimal dust.

11. Current limit function (output cur-

rent control)

1) Current limit function aims to increase

resistance to surges when the switch is

turned on. Before using this function,

connect the varistor to the output as

shown in the figure below.

1

6

2

Varistor

5

Surge:

10 × 160 µs, 1.6 KV

3

4

* Set the varistor voltage to 150 V or less.

2) The current limit function capability can

be lost if used longer than the specified

time. Be sure to set the output loss to the

max. rate.

6

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