LX1664 データシートの表示（PDF） - Microsemi Corporation
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LX1664 Datasheet PDF : 17 Pages
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PRODUCT DATABOOK 1996/1997
LX1664/64A, LX1665/65A
DUAL OUTPUT PWM CONTROLLERS WITH 5-BIT DAC
PRODUCTION DATA SHEET
D E S C R I P T I O N (con't.)
Smallest Package Size. The LX1664 is
available in a narrow body 16-pin surface
mount IC package for space sensitive appli-
cations. The LX1665 provides the additional
functions of Over Voltage Protection (OVP)
and Power Good (PWRGD) output drives
for applications requiring output voltage
monitoring and protection functions.
Ultra-Fast Transient Response re-
duces system cost. The modulated off-
time architecture results in the fastest tran-
sient response for a given inductor, reduc-
ing output capacitor requirements, and re-
ducing the total regulator system cost.
Over-Voltage Protection and Power
Good Flag. The OVP output in the LX1665
& LX1665A can be used to drive an SCR
crowbar circuit to protect the load in the
event of a short-circuit of the main MOSFET.
The LX1665 & LX1665A also have a logic-
level Power Good Flag to signal when the
output voltage is out of specified limits.
DEVICE
LX1664
LX1664A
LX1665
LX1665A
DEVICE SELECTION GUIDE
Packages
OVP and
Current-Sense
Power Good Comp. Thresh. (mV) Optimal Load
16-pin SOIC
& DIP
No
18-pin SOIC
& DIP
Yes
100
Pentium-class (<10A)
60
Pentium II (> 10A)
100
Pentium-class (<10A)
60
Pentium II (> 10A)
PACKAGE PIN OUTS
SS 1
INV 2
VCC_CORE
3
VID0 4
VID1 5
VID2 6
VID3 7
VID4 8
16
VC1
15 TDRV
14 GND
13 BDRV
12
VCC
11
CT
10
LDRV
9
LFB
N PACKAGE — 16-Pin
LX1664/1664A (Top View)
SS 1
INV 2
VCC_CORE
3
VID0 4
VID1 5
VID2 6
VID3 7
VID4 8
LFB
9
18
VC1
17 TDRV
16 GND
15 BDRV
14
VCC
13
CT
12 OV
11
LDRV
10 PWRGD
N PACKAGE — 18-Pin
LX1665/1665A (Top View)
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Supply Voltage (VC1) .................................................................................................... 25V
Supply Voltage (V ) .................................................................................................... 15V
CC
Output Drive Peak Current Source (500ns) ............................................................... 1.5A
Output Drive Peak Current Sink (500ns) ................................................................... 1.5A
Input Voltage (SS, INV, V , C , VID0-VID4) ........................................... -0.3V to 6V
CC_CORE T
Operating Junction Temperature
Plastic (N, D & DW Packages) ............................................................................. 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
THERMAL DATA
N (16-PIN DIP) PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
N (18-PIN DIP) PACKAGE:
65°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
60°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DW PACKAGE:
120°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
90°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The
θ
JA
numbers
are
guidelines
for
the
thermal
performance
of
the
device/pc-board
system.
All of the above assume no ambient airflow
SS
INV
VCC_CORE
VID0
VID1
VID2
VID3
VID4
1 16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VC1
TDRV
GND
BDRV
VCC
CT
LDRV
LFB
D PACKAGE — 16-Pin
LX1664/1664A (Top View)
SS
1
INV
2
VCC_CORE
3
VID0
4
VID1
5
VID2
6
VID3
7
VID4
8
LFB
9
18
VC1
17
TDRV
16
GND
15
BDRV
14
VCC
13
CT
12
OV
11
LDRV
10
PWRGD
DW PACKAGE — 18-Pin
LX1665/1665A (Top View)
2
Copyright © 1999
Rev. 1.2 11/99
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