UPD720101 データシートの表示（PDF） - NEC => Renesas Technology

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UPD720101

USB2.0 HOST CONTROLLER

NEC => Renesas Technology 

µPD720101

5. RECOMMENDED SOLDERING CONDITIONS

The µPD720101 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

µPD720101GJ-UEN: 144-pin plastic LQFP (Fine pitch) (20 × 20)

Soldering Method

Infrared reflow

Partial heating

Soldering Conditions

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 3 daysNote (after that, prebake at 125°C for 10 hours)

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

Symbol

IR35-103-3

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µPD720101F1-EA8: 144-pin plastic FBGA (12 × 12)

Soldering Method

Infrared reflow

Soldering Conditions

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours)

Symbol

IR35-107-3

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

32

Data Sheet S16265EJ4V0DS

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