UPD720100A データシートの表示（PDF） - NEC => Renesas Technology

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UPD720100A

USB2.0 HOST CONTROLLER

NEC => Renesas Technology 

µPD720100A

4. RECOMMENDED SOLDERING CONDITIONS

The µPD720100A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

µPD720100AGM-8ED: 160-pin plastic LQFP (Fine pitch) (24 × 24)

µPD720100AGM-8EY: 160-pin plastic LQFP (Fine pitch) (24 × 24)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

IR35-103-3

Count: Three times or less

Exposure limit: 3 daysNote (after that, prebake at 125°C for 10 hours)

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

µPD720100AS1-2C: 176-pin plastic FBGA (15 × 15)

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),

IR35-107-3

Count: Three times or less

Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours)

Partial heating

Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

30

Data Sheet S15535EJ2V0DS

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