GRM188R61A106KE69D データシートの表示（PDF） - Unspecified

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GRM188R61A106KE69D

Chip Monolithic Ceramic Capacitor for General

Unspecified 

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Land b

f4.5

a

100

Type

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

Dimension (mm)

a

b

0.2 *1,2：2.0±00..5065

0.3

0.9 φ1.

5

+ 0.1

-0

0.4

1.5

1.0

3.0

1.2

4.0

Ａ

2.2

5.0

2.2

5.0

c

4.0± 0.20.31

＊1 0.3＊2

0.5

1.2

1.65

2.0

2.9

0.05以下

t

Fig.1

(in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

50 min.

20

Pressurization

speed

1.0mm/s

Capacitor

Pressurize

R5

45

Support

Capacitance meter

45

45

Flexure

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・ Kind of Solder : Sn-3.0Ag-0.5Cu

・ Land Dimensions

Chip Capacitor

Land

a

b

Solder Resist

　

Fig.3

Type

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

Dimension (mm)

a

b

c

0.2

0.56

0.23

0.3

0.9

0.3

0.4

1.5

0.5

1.0

3.0

1.2

1.2

4.0

1.65

2.2

5.0

2.0

2.2

5.0

2.9

JEMCGS-00794F

5

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