HMC930 データシートの表示（PDF） - Hittite Microwave

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HMC930

GaAs pHEMT MMIC 0.25 WATT POWER AMPLIFIER, DC - 40 GHz

Hittite Microwave 

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3

HMC930

v00.0610

GaAs pHEMT MMIC

0.25 WATT POWER AMPLIFIER, DC - 40 GHz

Die Packaging Information [1]

Standard

Alternate

GP-1

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. DIE THICKNESS IS 0.004 (0.100)

3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE

4. BOND PAD METALIZATION: GOLD

5. BACKSIDE METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

8. OVERALL DIE SIZE IS ±.002

3-7

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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