UAA2077AM データシートの表示（PDF） - Philips Electronics

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UAA2077AM

Image rejecting front-end for DECT applications

Philips Electronics 

Philips Semiconductors

Image rejecting front-end

for DECT applications

Product specification

UAA2077AM

Table 1 Control of power status

EXTERNAL PIN LEVEL

RXON

LOW

HIGH

LOW

SXON

LOW

X

HIGH

CIRCUIT MODE OF OPERATION

power-down mode

RX mode (receive and LO sections on)

SX mode (only LO section on)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

MIN.

VCC

∆GND

supply voltage

−

difference in ground supply voltage applied between LOGND and LNAGND −

Pl(max)

maximum power input

−

Tj(max)

maximum operating junction temperature

−

Pmax

maximum power dissipation

−

Tstg

IC storage temperature

−65

MAX.

9

0.6

20

150

250

+150

UNIT

V

V

dBm

°C

mW

°C

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

Rth j-a

thermal resistance from junction to ambient in free air

VALUE

120

HANDLING

Every pin withstands the ESD test in accordance with “MIL-STD-883C Class 2 (method 3015.5)”.

UNIT

K/W

DC CHARACTERISTICS

VCC = 4.0 V; Tamb = 25 °C; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN. TYP.

Pins VCCLNA and VCCLO

VCC

supply voltage

Tamb = 0 to +70 °C

3.15

over full temperature range 3.6

ICC(RX)

ICC(PD)

ICC(SX)

supply current in RX mode

supply current in power-down mode

supply current in SX mode

21.5

−

3

Pins RXON, SXON and SBS

Vth

CMOS threshold voltage

note 1

VIH

HIGH level input voltage

VIL

LOW level input voltage

IIH

HIGH level static input current

pin at VCC − 0.4 V

IIL

LOW level static input current

pin at 0.4 V

−

0.7VCC

−0.3

−1

−1

4.0

4.0

26.5

0.2

5

1.25

−

−

−

−

MAX. UNIT

5.3

V

5.3

V

33.5 mA

50

µA

7

mA

−

V

VCC

V

+0.8 V

+1

µA

+1

µA

1996 Jul 04

6

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