XE5620 データシートの表示（PDF） - Xecom
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XE5620 Datasheet PDF : 18 Pages
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XE5620 Soldering Instructions
The XE5620 is subject to damage if over-exposed to heat during solder reflow operations. Following the
soldering instructions below will ensure that the process of soldering the module to the board does not damage
the modem. The XE5620 must not be exposed to direct Infrared (IR) heating. If your process includes direct IR
heating, you must shield the XE5620 from the infrared rays.
Maximum Temperature
Maximum Time at 220O C
Maximum Time above Eutectic (180O C)
220O C
20 Seconds
90 Seconds
Maximum Preheat Dwell Time 180 Seconds
Maximum Recommended Solder Temperature Profile
220O C
180O C
150O C
--------------------------------180 sec max ---------------------
-20 sec-
max
----- 90 sec max -----
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XE5620
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