STTH1302CT/CG/CFP
Fig. 11: Dynamic parameters versus junction tem-
perature.
QRR;IRM[Tj]/QRR;IRM[Tj=125°C]
1.4
IF=6.5A
VR=100V
1.2
IRM
1.0
0.8
0.6
QRR
0.4
0.2
0.0
0
Tj(°C)
25
50
75
100
125
150
Fig. 12: Thermal resistance junction to ambient ver-
sus copper surface under tab (epoxy printed board
FR4, Cu = 35µm)(D2PAK).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(cm²)
0
0
2
4
6
8
10 12 14 16 18 20
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
A
C
L7
D
M
E
REF.
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
4.40 4.60 0.173 0.181
1.23 1.32 0.048 0.051
2.40 2.72 0.094 0.107
0.49 0.70 0.019 0.027
0.61 0.88 0.024 0.034
1.14 1.70 0.044 0.066
1.14 1.70 0.044 0.066
4.95 5.15 0.194 0.202
2.40 2.70 0.094 0.106
10 10.40 0.393 0.409
16.4 typ.
0.645 typ.
13
14 0.511 0.551
2.65 2.95 0.104 0.116
15.25 15.75 0.600 0.620
6.20 6.60 0.244 0.259
3.50 3.93 0.137 0.154
2.6 typ.
0.102 typ.
5/7