SL74LVU04D データシートの表示（PDF） - System Logic Semiconductor
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SL74LVU04D Datasheet PDF : 6 Pages
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SL74LVU04
MAXIMUM RATINGS*
Symbol
VCC
IIK *1
IOK *2
IO *3
ICC
IGND
Parameter
DC supply voltage (Referenced to GND)
DC input diode current
DC output diode current
DC output source or sink current
-bus driver outputs
DC VCC current for types with
- bus driver outputs
DC GND current for types with
- bus driver outputs
Value
Unit
-0.5 ÷ +7.0
V
±20
mA
±50
mA
±25
mA
±50
mA
±50
mA
PD
Power dissipation per package, plastic DIP+
SOIC package+
750
mW
500
Tstg
Storage temperature
-65 ÷ +150
°C
TL
Lead temperature, 1.5 mm from Case for 10 seconds
260
°C
(Plastic DIP ), 0.3 mm (SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
*1: VI < -0.5V or VI > VCC+0.5V
*2: Vo < -0.5V or Vo > VCC+0.5V
*3: -0.5V < Vo < VCC+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
1.0
5.5
V
VIN, VOUT
DC Input Voltage, Output Voltage (Referenced
0
VCC
V
to GND)
TA
Operating Temperature, All Package Types
-40
+125
°C
tr, tf
Input Rise and Fall Time 1.0 V≤VCC <2.0 V
0
500
ns
2.0 V≤VCC <2.7 V
0
200
2.7 V≤VCC <3.6 V
0
100
3.6 V≤VCC ≤5.5 V
0
50
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages
to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
SLS System Logic
2
Semiconductor
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