PS200-I/SS データシートの表示（PDF） - Microchip Technology
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PS200-I/SS Datasheet PDF : 36 Pages
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PS200
6.2 Package Details
The following sections give the technical details of the
packages.
20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
E1
D
2
n
1
α
E
A
A2
β
eB
c
A1
B1
B
L
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
20
p
.100
20
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.295
.310
.325
7.49
7.87
Molded Package Width
E1
.240
.250
.260
6.10
6.35
Overall Length
D
1.025
1.033
1.040
26.04
26.24
Tip to Seating Plane
L
.120
.130
.140
3.05
3.30
Lead Thickness
c
.008
.012
.015
0.20
0.29
Upper Lead Width
B1
.055
.060
.065
1.40
1.52
Lower Lead Width
B
.014
.018
.022
0.36
0.46
Overall Row Spacing
§
eB
.310
.370
.430
7.87
9.40
Mold Draft Angle Top
α
5
10
15
5
10
Mold Draft Angle Bottom
β
5
10
15
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
MAX
4.32
3.68
8.26
6.60
26.42
3.56
0.38
1.65
0.56
10.92
15
15
DS21891B-page 28
© 2005 Microchip Technology Inc.
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