NJL6163R データシートの表示（PDF） - Japan Radio Corporation
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NJL6163R Datasheet PDF : 6 Pages
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NJL6163R/6163R-1
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
➀ Preparatory heating condition
: 120 to 150°C about 60 sec.
➁ Recommended soldering temperature : 230 to 240°C about 3 to 5 sec.
➂ Slowly cool down right after soldering.
➃ Soldering to be done within twice under this condition.
(°C)
250
240°C max.
3 to 5 sec.
200
150
Preparatory heating
60 to 120 sec.
100
Less than
30 sec.
50
0
Time
2) Reflow Method (In case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
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