MAAPGM0034 データシートの表示（PDF） - Tyco Electronics
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MAAPGM0034 Datasheet PDF : 7 Pages
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0.5W X/Ku-Band Power Amplifier
Figure 6. Recommended Bias Configuration
RO-P-DS-3070 6/6
MAAPGM0034
RFIN
604 O
V GG
100 pF
0.1 µF
100 pF
VDD
RFOUT
0.1 µF
Pin Number
1
2
3
4
5
6
7
8
9
10
Description
No Connection
No Connection
RF IN
No Connection
V GG
No Connection
No Connection
RF OUT
No Connection
V DD
Assembly Instructions:
This flange mount style package provides a robust interface between a highly integrated GaAs MMIC device and a circuit board
which may be assembled using conventional surface mount techniques. A thin shim made of a thermally and electrically
conductive, ductile material should be used prior to installation of the CR-15 to improve the thermal and electrical performance of
the package to housing interface. Refer to M/A-COM Application Note #M567* for more information .
For applications where surface mount components are to be installed after the CR-15 installation, this package will not be
damaged when subjected to typical convection or IR oven reflow profiles. Refer to M/A-COM Application Note #M538* for
maximum allowable reflow time and temperature. Alternatively, the package leads may be individually soldered. Whether an iron
or hot gas soldering equipment is used, care should be taken to insure that the temperature is well controlled and electric static
discharge (ESD) safe.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
* Application Notes can be found by going to the Site Search Page on M/A-COM’s web page
(http://www.macom.com/search/search.jsp) and searching for the required Application Note.
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
Visit www.macom.com for additional data sheets and product informVat1io.0n0.
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