L7200 データシートの表示（PDF） - Intel

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L7200

Intel® Core™2 Duo Mobile Processor for Intel® Centrino® Duo Mobile Processor Technology

Intel 

Contents

1 Introduction .............................................................................................................. 7

1.1 Terminology ....................................................................................................... 9

1.2 References ....................................................................................................... 10

2 Low Power Features ................................................................................................ 11

2.1 Clock Control and Low Power States .................................................................... 11

2.1.1 Core Low Power State Descriptions ........................................................... 13

2.1.2 Package Low Power State Descriptions ...................................................... 15

2.2 Enhanced Intel SpeedStep® Technology .............................................................. 18

2.3 Extended Low Power States ................................................................................ 19

2.4 FSB Low Power Enhancements ............................................................................ 19

2.5 Processor Power Status Indicator (PSI#) Signal..................................................... 20

3 Electrical Specifications ........................................................................................... 21

3.1 Power and Ground Pins ...................................................................................... 21

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................... 21

3.3 Voltage Identification ......................................................................................... 21

3.4 Catastrophic Thermal Protection .......................................................................... 25

3.5 Reserved and Unused Pins.................................................................................. 25

3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 26

3.7 FSB Signal Groups............................................................................................. 26

3.8 CMOS Signals ................................................................................................... 28

3.9 Maximum Ratings.............................................................................................. 28

3.10 Processor DC Specifications ................................................................................ 29

4 Package Mechanical Specifications and Pin Information .......................................... 39

4.1 Package Mechanical Specifications ....................................................................... 39

4.2 Processor Pinout and Pin List .............................................................................. 49

4.3 Alphabetical Signals Reference ............................................................................ 73

5 Thermal Specifications and Design Considerations .................................................. 81

5.1 Thermal Specifications ....................................................................................... 85

5.1.1 Thermal Diode ....................................................................................... 85

5.1.2 Thermal Diode Offset .............................................................................. 85

5.1.3 Intel® Thermal Monitor........................................................................... 87

5.1.4 Digital Thermal Sensor............................................................................ 89

5.1.5 Out of Specification Detection .................................................................. 90

5.1.6 PROCHOT# Signal Pin ............................................................................. 90

Datasheet

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