HPDL-1414(2000) データシートの表示（PDF） - HP => Agilent Technologies
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HPDL-1414 Datasheet PDF : 8 Pages
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Optical Considerations/
Contrast Enhancement
The HPDL-1414 display uses a
precision aspheric immersion
lens to provide excellent
readability and low off-axis
distortion. The aspheric lens
produces a magnified character
height of 2.85 mm (0.112 in.)
and a viewing angle of ± 40°.
These features provide excellent
readability at distances up to 1.5
metres (4 feet).
Each display is tested for
luminous intensity and marked
with an intensity category on the
side of the display package. To
ensure intensity matching for
multiple package applications,
mixing intensity categories for a
given panel is not recommended.
The display is designed to
provide maximum contrast when
placed behind an appropriate
contrast enhancement filter. For
further information on contrast
enhancement, see Application
Note 1015.
Mechanical and Electrical
Considerations
The HPDL-1414 is a dual in-line
package that can be stacked
horizontally and vertically to
create arrays of any size. These
displays are designed to operate
continuously between –40°C to
+85°C with a maximum of 10
segments on per digit.
The HPDL-1414 is assembled by
die attaching and wire bonding
the four GaAsP/GaAs monolithic
LED chips and the CMOS IC to a
printed circuit board. An
immersion lens is formed by
placing the PC board assembly
into a nylon lens filled with
epoxy. Backfill epoxy environ-
mentally seals the display
package. This package
construction provides the display
with a high tolerance to
temperature cycling.
The inputs to the CMOS IC are
protected against static discharge
and input current latchup.
However, for best results
standard CMOS handling
precautions should be used. Prior
to use, the HPDL-1414 should be
stored in anti-static tubes or
conductive material. During
assembly a grounded conductive
work area should be used, and
assembly personnel should wear
conductive wrist straps. Lab
coats made of synthetic material
should be avoided since they are
prone to static charge build-up.
Input current latchup is caused
when the CMOS inputs are
subjected either to a voltage
below ground (VIN < ground) or
to a voltage higher than VDD
(VIN > VDD) and when a high
current is forced into the input.
To prevent input current latchup
and ESD damage, unused inputs
should be connected either to
ground or to VDD. Voltages should
not be applied to the inputs until
VDD has been applied to the
display. Transient input voltages
should be eliminated.
Soldering and Post Solder
Cleaning Instructions
The HPDL-1414 may be hand
soldered or wave soldered with
SN63 solder. Hand soldering may
be safely performed only with an
electronically temperature-
controlled and securely grounded
soldering iron. For best results,
the iron tip temperature should
be set at 315°C (600°F). For
wave soldering, a rosin-based
RMA flux can be used. The solder
wave temperature should be
245°C ± 5°C (473°F ± 9°F),
and the dwell in the wave should
be set at 11/2 to 3 seconds for
optimum soldering. Preheat
temperature should not exceed
93°C (200°F) as measured on the
solder side of the PC board.
For further information on
soldering and post solder
cleaning, see Application Note
1027, Soldering LED
Components.
7
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