HC-55564 データシートの表示（PDF） - Harris Semiconductor
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HC-55564 Datasheet PDF : 9 Pages
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HC-55564
Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
12 3
E1
N/2
-B-
-A-
D
E
BASE
PLANE
SEATING
PLANE
-C- A2 A
L
CL
D1
D1
A1
eA
B1
e
B
eC
C
0.010 (0.25) M C A B S
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpen-
dicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 -
1.14mm).
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115 0.195 2.93
4.95
-
B
0.014 0.022 0.356 0.558
-
B1
0.045 0.070 1.15
1.77
8
C
0.008 0.014 0.204 0.355
-
D
0.735 0.775 18.66 19.68
5
D1
0.005
-
0.13
-
5
E
0.300 0.325 7.62
8.25
6
E1
0.240 0.280 6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115 0.150 2.93
3.81
4
N
14
14
9
Rev. 0 12/93
8
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