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AD1981B データシートの表示(PDF) - Analog Devices

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AD1981B
ADI
Analog Devices ADI
AD1981B Datasheet PDF : 28 Pages
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AD1981B
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C, unless otherwise noted.)
Power Supplies
Digital (DVDD) . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
Analog (AVDD) . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.0 V
Input Current (Except Supply Pins) . . . . . . . . . . . . . . ± 10 mA
Signals Pins
Digital Input Voltage . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V
Analog Input Voltage . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Ambient Temperature Range (Operating) . . . . . . . 0°C to 70°C
*Stresses greater than those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ENVIRONMENTAL CONDITIONS*
Ambient Temperature Rating (LQFP Package)
TCASE = Case Temperature in °C
PD = Power Dissipation in W
JA Thermal Resistance (Junction to Ambient)
JC Thermal Resistance (Junction to Case)
Package
LQFP
JA
50.1°C/W
JC
17.8°C/W
*All measurements per EIA-JESD51 with 2S2P test board per EIA-JESD51-7
Model
ORDERING GUIDE
Temperature Range
Package Description
Package Option1
AD1981BJST
AD1981BJST-REEL
AD1981BJSTZ2
AD1981BJSTZ-REEL2
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
48-Lead LQFP (Tray)
48-Lead LQFP (Reel)
48-Lead LQFP (Tray)
48-Lead LQFP (Reel)
ST-48
ST-48
ST-48
ST-48
1ST = Low Profile Quad Flatpack.
2The AD1981BJSTZ is a lead-free environmentally friendly product. It is manufactured using the most up-to-date materials and processes. The coating on the leads of
each device is 100% pure tin electroplate. The device is suitable for lead-free applications and is able to withstand surface-mount soldering at up to 255 °C (± 5°C). In
addition, it is backward compatible with conventional tin-lead soldering processes. This means that the electroplated tin coating can be soldered with tin-lead solder
pastes at reflow temperatures of 220°C to 235°C.
PIN CONFIGURATION
48-Lead LQFP
DVDD1 1
XTL_IN 2
XTL_OUT 3
DVSS1 4
SDATA_OUT 5
BIT_CLK 6
DVSS2 7
SDATA_IN 8
DVDD2 9
SYNC 10
RESET 11
NC 12
NC = NO CONNECT
AD1981B
TOP VIEW
(Not to Scale)
36 LINE_OUT_R
35 LINE_OUT_L
34 AVDD4
33 AVSS4
32 AFILT4
31 AFILT3
30 AFILT2
29 AFILT1
28 VREFOUT
27 VREF
26 AVSS1
25 AVDD1
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD1981B features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. B
–7–

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