datasheetbank_Logo
データシート検索エンジンとフリーデータシート

ACT4455 データシートの表示(PDF) - Active-Semi, Inc

部品番号
コンポーネント説明
一致するリスト
ACT4455
ACTIVE-SEMI
Active-Semi, Inc ACTIVE-SEMI
ACT4455 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ACT4455
Rev 2, 21-Nov-12
STABILITY COMPENSATION CONT’D
In the case of high RFB1 used, the frequency
compensation needs to be adjusted
correspondingly. As show in Figure 4, adding a
capacitor in paralled with RFB1 or increasing the
compensation capacitance at COMP pin helps the
system stability.
Figure 3:
Cable Compensation at Various Resistor Divider
Values
Delta Output Voltage vs. Output Current
0.6
single point for best noise immunity. Connect
exposed pad to power ground copper area with
copper and vias.
4) Use copper plane for power GND for best heat
dissipation and noise immunity.
5) Place feedback resistor close to FB pin.
6) Use short trace connecting HSB-CHSB-SW loop
7) SW pad is noisy node switching from VIN to
GND. It should be isolated away from the rest
of circuit for good EMI and low noise operation.
0.5
0.4
0.3
0.2
0.1
0
0
= 300k
R FB1
v
R FB1
==227400kk
R
FB1
=
200k
R FB1
RFB1 =
150k
RFB1 = 100k
RFB1 = 51k
1000
2000
3000
4000
5000
Output Current (mA)
Figure 4:
Frequency Compensation for High RFB1
PC Board Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
1) Arrange the power components to reduce the
AC loop size consisting of CIN, IN pin, SW pin
and the schottky diode.
2) Place input decoupling ceramic capacitor CIN as
close to IN pin as possible. CIN is connected
power GND with vias or short and wide path.
3) Return FB, COMP and ISET to signal GND pin,
and connect the signal GND to power GND at a
Innovative PowerTM
-9-
www.active-semi.com
Copyright © 2012 Active-Semi, Inc.

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]