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STS6DNF30L データシートの表示(PDF) - STMicroelectronics

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STS6DNF30L Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
STS6DNF30L
THERMAL DATA
Rthj-amb *Thermal Resistance Junct ion-ambient Single Operation
Dual Operation
Tj
Maximum O perating Junction Temperature
Ts tg Storage T emperature
(*) Mounted on FR-4 board (Steady State)
78
62.5
150
-65 to 150
oC/W
oC/W
oC
oC
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)D SS
IDSS
IGSS
P ar am et e r
Test Conditions
Dr ain- s our c e
Breakdown Voltage
ID = 250 µA VGS = 0
Zero Gate Voltage
VDS = Max Rat ing
Drain Current (VGS = 0) VDS = Max Rat ing
Tc = 125 oC
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20 V
Min.
30
Typ. Max.
1
10
± 100
Unit
V
µA
µA
nA
ON ()
Symbo l
VGS(th)
RDS(on)
P ar am et e r
Test Conditions
Gat e Threshold Voltage VDS = VGS ID = 250 µA
Static Drain-source On VGS = 10 V ID = 3 A
Resistance
VGS = 4.5 V ID = 3 A
Min.
1
Typ.
1.6
0.022
0.025
Max.
2.5
0.025
0.032
Unit
V
ID(o n) On State Drain Current VDS > ID(o n) x RDS(on )max
6
A
VGS = 10 V
DYNAMIC
Symbo l
gfs ()
Ciss
Coss
Crss
P ar am et e r
Forward
Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS > ID(o n) x RDS(on )ma x ID = 3 A
Min.
Typ.
9
Max.
Unit
S
VDS = 25 V f = 1 MHz VGS = 0 V
1250
pF
230
pF
50
pF
2/8

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