MT29F256G08CKCAB データシートの表示（PDF） - Micron Technology

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MT29F256G08CKCAB

NAND Flash Memory

Micron Technology 

Micron Confidential and Proprietary

Advance

64Gb, 128Gb, 256Gb, 512Gb Asynchronous/Synchronous NAND

Package Dimensions

Figure 8: 100-Ball TBGA – 12mm x 18mm (Package Code: H2)

Seating

plane

0.12 A A

0.73 ±0.05

100X Ø0.45

Solder ball material:

SAC305 (96.5% Sn,

3% Ag, 0.5% Cu).

Dimensions apply to

solder balls post-reflow

on Ø0.4 SMD ball pads.

12 ±0.1

10 9 8 7 6 5 4 3 2 1

Ball A1 ID

A

B

8

7

16 CTR

1 TYP

D

E

F

G

H

J 18 ±0.1

K

L

M

N

P

T

U

Bottom side

fiducials may

or may not be

covered with

soldermask.

1 TYP

1 TYP

9 CTR

Note: 1. All dimensions are in millimeters.

Ball A1 ID

1.2 MAX

0.25 MIN

PDF: 09005aef83d2277a

Rev. A 11/09 EN

17

Micron Technology, Inc. reserves the right to change products or specifications without notice.

©2009 Micron Technology, Inc. All rights reserved.

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