CB61F2A データシートの表示（PDF） - Cooper Bussmann, Inc.

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CB61F2A

Fast-Acting SMD Brick™ Fuses

Cooper Bussmann, Inc. 

Soldering Characteristics

Wave Immersion

• Reservoir Temperature: 260° C

• Time in Reservoir : 10 Seconds Maximum

Infrared Reflow

• Temperature: 260° C

• Time: 30 Seconds Maximum

Hand Soldering

• Maximum tip temperature: 350°C

• Maximum soldering time: 5 seconds max

Recommend Reflow Profile

Recommended Pad Layout

Packaging Code Suffix

-TR1

-TR2

Packaging Code

Description

1000 Fuses in Tape and Reel on 7 inch (178mm) diameter reel

5000 Fuses in Tape and Reel on 13 inch (330mm) diameter reel

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is

intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change

design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-

tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.

Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-

port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result

in significant injury to the user.

© 2012 Cooper Bussmann

www.cooperbussmann.com

0112 BU-SB111447

Page 3 of 3

Data Sheet 4377

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