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Package Outline Unit : mm
CXG1027TM
10PIN TSSOP(PLASTIC)
∗2.8 ± 0.1
10
6
1.2MAX
0.1
+ 0.15
0.1 – 0.05
1
0.22
5
0.5
0.1 M
0.25
0° to 10°
A
(0.2)
+ 0.08
0.22 – 0.07
DETAIL A
NOTE: “∗” Dimensions do not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSSOP-10P-L01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
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