datasheetbank_Logo
データシート検索エンジンとフリーデータシート

XC6224 データシートの表示(PDF) - TOREX SEMICONDUCTOR

部品番号
コンポーネント説明
一致するリスト
XC6224 Datasheet PDF : 26 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
XC6224 Series
PACKAGING INFORMATION (Continued)
SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125)
Ambient Temperature(℃) Power Dissipation PdmW
25
500
85
200
Thermal Resistance (/W)
200.00
20/26

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]