UPD72852A データシートの表示（PDF） - NEC => Renesas Technology

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UPD72852A

IEEE1394a-2000 COMPLIANT 400 Mbps TWO-PORT PHY LSI

NEC => Renesas Technology 

µPD72852A

9. RECOMMENDED SOLDERING CONDITIONS

The µPD72852A should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact your NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Table 9-1. Surface Mounting Type Soldering Conditions

µPD72852AGB-8EU: 64-pin plastic LQFP (10 × 10)

Soldering

Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).

Count: three times or less

Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours)

IR35-103-3

Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)

—

Note After opening the dry pack, store it at 25°C or less and 65 % RH or less for the allowable storage period.

46

Data Sheet S16725EJ2V0DS

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