TORX179P データシートの表示（PDF） - Toshiba

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TORX179P

FIBER OPTIC RECEIVING MODULE

Toshiba 

5. Application Circuit

TORX179P

6. Required Optical Fiber with Fiber Optic Connectors

TOCP172−□□B

7. Board layout hole pattern (for reference)

Unit: mm

Recommended PCB thickness: 1.6 mm

8. Precautions on Use

(1) Maximum rating

The maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If the maximum rating value is exceeded, the

characteristics of devices may never be restored properly. In extreme cases, the device may be

permanently damages.

(2) Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical

modules are optical components. During soldering, ensure that flux does not contact with the emitting

surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction

when the optical module is not in use. Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where

there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend

that soldering be performed without the optical module mounted on the board. Then, after the board

has been cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make

sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the

effects of flux. In such a cases, be sure to check the devices' reliability.

3

2001-08-31

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