TICP206 データシートの表示（PDF） - Power Innovations Ltd

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TICP206

SILICON TRIACS

Power Innovations Ltd 

TICP206 SERIES

SILICON TRIACS

MARCH 1988 - REVISED MARCH 1997

MECHANICAL DATA

LP003 (TO-92)

3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

LP003 (TO-92) - Formed Leads Version

5,21

4,44

3,43 MIN.

2,67

2,03

LP003 Falls Within JEDEC

TO-226AA Dimensions

4,19

3,17

2,67

2,03

5,34

4,32

4,00 MAX.

0,56

0,40

1

2

3

2,90

0,41

2,40

0,35

2,90

2,40

ALL LINEAR DIMENSIONS IN MILLIMETERS

PRODUCT INFORMATION

MDXXAR

5

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