TGA4521(2005) データシートの表示（PDF） - TriQuint Semiconductor

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TGA4521
(Rev.:2005)

32 - 45 GHz Wide Band Driver Amplifier

TriQuint Semiconductor 

Advance Product Information

October 28, 2005

TGA4521

Mechanical Drawing

0.750

(0.030)

0.651

(0.026)

0.086 0.267 0.346

(0.003) (0.011) (0.014)

1.167 1.316

1.490

(0.046) (0.052) (0.059)

0.651

(0.026)

0.353

(0.014)

RC

B

0

0 0.113

(0.004)

0.793

(0.031)

Units: millimeters (inches)

Thickness: 0.100 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND is back side of MMIC

Bond pad #1

Bond pad #2

Bond pad #3, 9

Bond pad #4, 5, 7

Bond pad #6

Bond pad #8

(RF In)

(N/C)

(Vg)

(Vd)

(N/C)

(RF Out)

0.100 x 0.200

0.081 x 0.100

0.108 x 0.108

0.108 x 0.108

0.091 x 0.084

0.100 x 0.200

(0.004 x 0.008)

(0.003 x 0.004)

(0.004 x 0.004)

(0.004 x 0.004)

(0.004 x 0.003)

(0.004 x 0.008)

0.217

(0.009)

1.485 1.600

(0.058) (0.063)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

7

TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

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