TGA4506 データシートの表示（PDF） - TriQuint Semiconductor
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TGA4506 Datasheet PDF : 10 Pages
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Chip Assembly Diagram
Vg
TGA4506
RF In
RF Out
Vd
All three Vd pads (pad # 9, 10, 11 from mechanical drawing)
do not need to be connected
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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