TGA4501-EPU データシートの表示（PDF） - TriQuint Semiconductor
部品番号
コンポーネント説明
一致するリスト
TGA4501-EPU Datasheet PDF : 9 Pages
| |||
Advanced Product Information
December 14, 2001
TGA4501-EPU
Chip Assembly & Bonding Diagram
Note: Please refer to page 8 for a magnified view of the chip assembly and bonding diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
6
Share Link: 