SX1230
ADVANCED COMMUNICATIONS & SENSING
Table of contents
Section
DATASHEET
Page
7.4. Wake-up Times.............................................................................................................................................. 29
7.5. Reset Pin Timing............................................................................................................................................ 29
7.6. Operation with 17 dBm Output Power............................................................................................................31
7.7. Matching for 13 dBm Output Power and Below.............................................................................................33
7.8. TCXO Connection..........................................................................................................................................34
7.9. PCB Layout Considerations........................................................................................................................... 34
8. Reference Design .................................................................................................................................................. 35
9. Reference Design Performance ............................................................................................................................ 36
9.1. Power Output versus Consumption ............................................................................................................... 36
9.2. Power Output Flatness versus Temperature and Supply Voltage.................................................................37
9.3. Phase Noise................................................................................................................................................... 38
9.4. SX1230 Baseband Filtering...........................................................................................................................40
9.5. Adjacent Channel Power ............................................................................................................................... 40
10. Packaging Information ........................................................................................................................................... 43
11. Package Marking ................................................................................................................................................... 43
12. Recommended PCB Land Pattern ........................................................................................................................ 44
13. Soldering Profile......................................................................................................................................................45
SX1230, Revision 2 May 2009
©2008 Semtech Corp.
Page 3
www.semtech.com