STV8162D(2009) データシートの表示（PDF） - STMicroelectronics

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STV8162D
(Rev.:2009)

+5 V, +5 V and +8 V triple voltage regulator with disable and reset functions

STMicroelectronics 

STV8162

Power dissipation and layout indications

5

Power dissipation and layout indications

The power is mainly dissipated by the three device buffers. It can be calculated by the

equation:

P = (VIN1-VOUT1) x IOUT1 + (VIN2-VOUT2) x IOUT2 + (VIN3-VOUT3) x IOUT3

The following table lists the different RthJA values of these packages with or without a heat

sink and the corresponding maximum power dissipation assuming:

● Maximum ambient temperature = 70° C

● Maximum junction temperature = 140° C

Table 5. Power dissipation

Device

Heat Sink

RthJA in °C/W

PMAX in W

No

50

1.4

STV8162

Yes

t(s) No

STV8162D

Yes

15

56 to 40

32

4.6

1.25 to 1.75

2.2

duc Figure 8. Thermal resistance (junction-to-ambient) of DIP18 package without heatsink

Pro To optimize the thermal conductivity of the copper

te 60

layer and the exchanges with the air, the solder

must cover the maximum amount of this area.

ole 55

s Test Board with

b 50

“On Board” square heat sink area.

- O 45

t(s) 40

0

2

4

6

8

10 12

uc Copper area (cm²) (35 µm plus solder) Board is face-down

Obsolete Prod Figure 9. Metal plate mounted near STV8162D for heatsinking

Top View

Bottom View

9/14

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