STTH3002CPI(2006) データシートの表示（PDF） - STMicroelectronics

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STTH3002CPI
(Rev.:2006)

High efficiency ultrafast diode

STMicroelectronics 

STTH3002C

Package information

Table 9. D2PAK dimensions

DIMENSIONS

REF. Millimeters

Inches

Min. Max Min. Max.

A 4.40 4.60 0.173 0.181

E

L2

A

C2

A1 2.49

A2 0.03

B 0.70

2.69 0.098 0.106

0.23 0.001 0.009

0.93 0.027 0.037

D

B2 1.14 1.70 0.045 0.067

L

C 0.45 0.60 0.017 0.024

L3

A1

C2 1.23 1.36 0.048 0.054

B2

B

C

R

D 8.95 9.35 0.352 0.368

G

E 10.00 10.40 0.393 0.409

A2

2mm min.

FLAT ZONE

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

V2

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R

0.40 typ.

0.016 typ.

V2

0°

8°

0°

8°

Figure 11. D2PAK footprint (dimensions in mm)

16.90

10.30

8.90

5.08

1.30

3.70

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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