STM1645-30 データシートの表示（PDF） - STMicroelectronics

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STM1645-30

RF POWER MODULE SATELLITE COMMUNICATION APPLICATIONS

STMicroelectronics 

STM1645-30

APPLICATIONS RECOMMENDATIONS

OPERATION LIMITS

The STM1645-30 power module should never be

operated under any condition which exceeds the

Absolute Maximum Ratings presented on this

data sheet. Nor should the module be operated

continuously at any of the specified maximum

ratings. If the module is to be subjected to one or

more of the maximum rating conditions, care

must be taken to monitor other parameters which

may be affected.

MODULE MOUNTING

To insure adequate thermal transfer from the

module to the heatsink, it is recommended that a

satisfactory thermal compound such as Dow

Corning 340, Wakefield 120-2 or equivalent be

applied between the module flange and the

heatsink.

The heatsink mounting surface under the module

should be flat to within ± 0.05 mm (± 0.002 Inch).

The module should be mounted to the heatsink

using 3.5 mm (or 6-32) or equivalent screws

torqued to 5-6 Kg-cm (4-6 in-lb).

The module leads should be attached to

equipment PC board using 180oC solder applied

to leads with a properly grounded soldering iron

tip, not to exceed 195 oC, applied a minimum of 2

mm (0.080 inch) from the body of the module for

a duration not to exceed 15 seconds per lead. It

is imperative that no other portion of the module,

other than the leads, be subjected to temperature

in excess of 100 oC (maximum storage

temperature), for any period of time, as the

plastic moulded cover, internal components and

sealing adhesives may be advertisely affected by

such conditions.

Due to the construction techniques and materials

used within the module, reflow soldering of the

flange heatsink or leads, is not recommended.

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