HMC135 データシートの表示（PDF） - Hittite Microwave

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HMC135

GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz

Hittite Microwave 

v03.1007

Outline Drawing

HMC135

GaAs MMIC BI-PHASE

MODULATOR, 1.8 - 5.2 GHz

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Die Packaging Information [1]

Standard

Alternate

WP-3

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. TYPICAL BOND PAD IS .004” SQUARE.

3. BOND PAD SPACING IS .006” CENTER TO CENTER.

4. BACKSIDE METALIZATION: GOLD.

5. BACKSIDE METAL IS GROUND.

6. BOND PAD METALIZATION: GOLD.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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