SPM0204UD5 データシートの表示（PDF） - Unspecified

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SPM0204UD5

ULTRASONIC ACOUSTIC SENSOR

Unspecified 

10. SOLDER REFLOW PROFILE

SPM0204UD5

170–180°C

230°C

260°C

Pre-heat

Solder Melt

Stage

Pre-heat

120 sec.

100 sec.

Temperature

Profile

Time

(maximum)

170 ~ 180 C

120 sec.

Solder Melt

Above 230 C

100 sec.

Peak

260 C maximum

30 sec.

Notes:

•

Do not pull a vacuum over the port hole of the microphone.

Pulling a vacuum over the port hole can damage the

device.

•

Do not board wash after the reflow process. Board

washing and cleaning agents can damage the device. Do

not expose to ultrasonic processing or cleaning.

•

Number of Reflow = recommend no more than 3 cycles.

11. ADDITIONAL NOTES

(A) Packaging (reference SiSonic_Packaging_Spec.pdf)

(B) Shelf life: Twelve (12) months when devices are to be stored in factory supplied,

unopened ESD moisture sensitive bag under maximum environmental conditions of 30ºC,

70% R.H.

(C) Exposure: Devices should not be exposed to high humidity, high temperature

environment. MSL (moisture sensitivity level) Class 2.

(D) Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum

conditions of 30ºC/70% R.H.

Knowles Acoustics,

a division of Knowles Electronics, LLC

Revision: PRELIMINARY

Page 7 of 9

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