SP2526EB データシートの表示（PDF） - Signal Processing Technologies
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SP2526EB Datasheet PDF : 8 Pages
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SP2526 EVALUATION BOARD
The next two sections describe the SP2526 Board
Layout and Using the SP2526 Evaluation
Boards. A table of SP2526 Pin Assignments is
also included with details on Input/Output pin
function. A SP2526 Evaluation Board List
of Materials table is provided with some
manufacturers part numbers to use as a
reference. Finally, a schematic and drawings of
the PC Board Layout are included of the
SP2526 Evaluation Board.
BOARD LAYOUT
The SP2526 Evaluation Board has been
designed to easily and conveniently provide
access to all Inputs and Outputs of the SP2526
device under test. Position the board with the
silkscreen lettering upright (see Figure 1
Component Layout) and you will see the
SP2526 SOIC labeled U1 in the center right of
the board, and around it the Capacitors C1,2,3
and Ferrite Beads F1-4 forming the Dual USB
Supervisory Switch.
The SP2526 Evaluation Board provides solder
pads to connect wires to an external power
supply and load, as well as Test Point Posts
to monitor the Input and Output Voltages at
these connections to the SP2526. The SP2526
PC Board Layout has been designed with low
resistance input and output connections of 2mΩ
each to provide the lowest On-Resistance for
utilizing the USB Switch.
The PC Layout is given in Figures 1-3 for the
user as an aid in designing a low resistance USB
switch on a PC board. The PC board used has 1oz
Copper with V , Ground, V traces of at least
IN
OUT
0.1inch width for 5mΩ/inch or looked at another
way as 0.5mΩ/square. This means to maintain a
trace resistance of only 2mΩ, you need to have
only 4 squares of trace from one end to another.
Resistance is further reduced by some additional
wide VIN, Ground and VOUT connections on the
bottom side of the PC board which are connected
to the top side with large through-hole
connections. For best results with on-resistance
in the ferrites used for EMI suppression in the
Output and Ground connections, through-hole
ferrite beads were used for F1-4, yielding 2mΩ
per input or output connection versus using
surface-mount size 0805 ferrite beads which
yielded 5mΩ per input or output connection.
USING THE EVALUATION BOARD
The SP2526 Evaluation Board can be connected
to a power supply using a pair of wires soldered
to the solder pads marked provided “VIN” and
“GND”. It is good practice to not switch power
on until power connections are made to the
evaluation board.
Powering Up & Using the SP2526 Circuit
VIN — U1-7 — Solder wire to VIN solder
pad on component side of board and connect to
external Power Supply positive. V = +3.0V
IN
to +5.5V. Connect Voltmeter positive or
Oscilloscope probe to VIN test point post to
monitor actual voltage input to PC board.
GND — U1-6 — Solder wire to GND solder
pad on component side of board and connect to
external Power Supply negative. Connect
Voltmeter negative or Oscilloscope probe
ground to GND test point post to monitor
actual voltage input to PC board.
OUTA — U1-8 — Solder wire to OUTA solder
pad on component side of board and connect
to external load. Connect Voltmeter positive
or Oscilloscope probe to OUTA test point post
to monitor actual voltage output at the PC board.
GNDA — Solder wire to GNDA solder pad
on component side of board and connect to
external LoadA return. Connect Voltmeter
negative or Oscilloscope probe ground to
GND test point post to monitor actual voltage
input to PC board.
OUTB — U1-5 — Solder wire to OUTB solder
pad on component side of board and connect
to external load. Connect Voltmeter positive
or Oscilloscope probe to OUTB test point post
to monitor actual voltage output at the PC board.
GNDB — Solder wire to GNDB solder pad on
component side of board and connect to external
LoadB return. Connect Voltmeter negative or
Oscilloscope probe ground to GND test point post
to monitor actual voltage input to PC board.
SP2526EB/02
SP2526 Evaluation Board Manual
2
© Copyright 2000 Sipex Corporation
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