SP0103BE3 データシートの表示（PDF） - Unspecified

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SP0103BE3

“Zero Height” Amplified SiSonic™ Microphone Specification

Unspecified 

SP0103BE3

11. SOLDER REFLOW PROFILE

Notes:

1.

Maximum condition = 260 C for 30

seconds.

2.

Do not pull a vacuum over the port

hole of the microphone. Pulling a

vacuum over the port hole can

damage the device.

3.

Do not board wash after the reflow

process. Board washing and

cleaning agents can damage the

device. Do not expose to ultrasonic

processing or cleaning.

4.

Number of Reflow = recommend no

more than 2 cycles.

12. ADDITIONAL NOTES

(A) Packaging (reference SiSonic_Packaging_Spec.pdf)

(B) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened

moisture sensitivity bag under environmental conditions of 30ºC, 60% R.H.

(C) Exposure: Devices should not be exposed to high humidity, high temperature environment.

Customer should follow standard baking times as stated in JEDEC J-STD -033A, reference

Class 2A.

Out of bag: 90 days out of ESD moisture sensitive bag, assuming 30C/60% RH as

maximum.

Baking Condition: After 90 days, refer to JEDEC J-STD-033A for recommend baking times

and temperatures.

Knowles Acoustics, a division of Knowles

Electronics, LLC.

Revision: A

9 of 11

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