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SC4211EVB データシートの表示(PDF) - Semtech Corporation

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SC4211EVB Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
SC4211
POWER MANAGEMENT
Applications Information
Introduction
The SC4211 is intended for applications where high cur-
rent capability and very low dropout voltage are required.
It provides a very simple, low cost solution that uses very
little PCB real estate. Additional features include an en-
able pin to allow for a very low power consumption standby
mode, and a fully adjustable output.
Component Selection
Input capacitor: A large bulk capacitance of about
10uF/A (output load) should be closely placed to the
input supply pin of the SC4211 to ensure that Vin does
not sag below 1.4V. Also a minimum of 4.7µF ceramic
capacitor is recommended to be placed directly next to
the Vin pin. This allows for the device being some dis-
tance from any bulk capacitance on the rail. Additionally,
input droop due to load transients is reduced, improving
load transient response. Additional capacitance may be
added if required by the application.
Output capacitor: A minimum bulk capacitance of
10µF/A (output load), along with a 0.1µF ceramic de-
coupling capacitor is recommended. Increasing the bulk
capacitance will improve the overall transient response.
The use of multiple lower value ceramic capacitors in
parallel to achieve the desired bulk capacitance will not
cause stability issues. Although designed for use with ce-
ramic output capacitors, the SC4211 is extremely toler-
ant of output capacitor ESR values and thus will also
work comfortably with tantalum output capacitors.
Noise immunity: In very electrically noisy environments,
it is recommended that 0.1µF ceramic capacitors be
placed from IN to GND and OUT to GND as close to the
device pins as possible.
Internal voltage selection: By connecting the FB pin to
GND, an internal resistor divider will regulate the output
voltage to 1.0V. If the FB pin is connected directly to the
VO pin, the output voltage will be regulated to the 0.5V
internal reference.
Enable: Pulling this pin below 0.4V turns the regulator
off, reducing the quiescent current to a fraction of its
operating value. A pull up resistor up to 400kOhms should
be connected from this pin to the VIN pin in application
where supply voltages of Vin < 1.9V is required. For ap-
plications with higher voltages than 1.9V, EN pin could
be left open or connected to VIN.
Thermal Considerations
The power dissipation in the SC4211 is approximately
equal to the product of the output current and the input
to output voltage differential:
PD (VIN VOUT )I O
The absolute worst-case dissipation is given by:
( ) PD(MAX) = VIN (MAX) VOUT (MIN) I O(MAX) + VIN (MAX) I Q(MAX)
For a typical scenario, V = 3.3V ± 5%, V = 2.8V and
IN
OUT
I = 1A, therefore:
O
VIN(MAX) = 3.465V, VOUT(MIN) = 2.744V and IQ(MAX) = 1.75mA,
Thus P = .722W.
D(MAX)
Using this figure, and assuming TA(MAX) = 70°C, we can cal-
culate the maximum thermal impedance allowable to main-
tain
T
J
150°C:
( ) ( ) R = TH(JA)(MAX)
TJ(MAX) TA(MAX)
PD(MAX)
=
150 70
.722
= 110°C/W
This should be achievable for the SOIC-8-EDP package
using PCB copper area to aid in conducting the heat away,
such as one square inch of copper connected to the ground
pins of the device. Internal ground/power planes and air
flow will also assist in removing heat. For higher ambient
temperatures it may be necessary to use additional cop-
per area.
External voltage selection resistors: The use of 1%
resistors, and designing for a current flow 10µA is
recommended to ensure a well regulated output (thus
R2 50k).
2007 Semtech Corp.
7
www.semtech.com

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