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SC1563 データシートの表示(PDF) - Semtech Corporation

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SC1563 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
SC1563
POWER MANAGEMENT
Applications Information
Introduction
Thermal Considerations
The SC1563 is intended for applications such as
graphics cards where high current capability and very low
dropout voltage are required. It provides a very simple,
low cost solution that uses little pcb real estate.
Additional features include a shutdown pin to allow for a
very low power consumption standby mode, and a fully
adjustable output.
The power dissipation in the SC1563 is approximately
equal to the product of the output current and the input
to output voltage differential:
( ) PD VIN VOUT IOUT
The absolute worst-case dissipation is given by:
Component Selection
Input capacitor - a 1µF ceramic capacitor is
recommended. This allows for the device being some
distance from any bulk capacitance on the rail.
Additionally, input droop due to load transients is reduced,
improving load transient response. Additional capacitance
may be added if required by the application.
Output capacitor - a minimum bulk capacitance of 1µF,
along with a 0.1µF ceramic decoupling capacitor is
recommended. Increasing the bulk capacitance will
improve the overall transient response. The use of
multiple lower value ceramic capacitors in parallel to
achieve the desired bulk capacitance will not cause
stability issues. Although designed for use with ceramic
output capacitors, the SC1563 is extremely tolerant of
output capacitor ESR values and thus will also work
comfortably with tantalum output capacitors.
( ) PD(MAX) =
V V IN(MAX )
OUT (MIN )
IOUT(MAX ) + VIN(MAX ) IQ(MAX )
For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.5V and
IOUT = 500mA, therefore:
VIN(MAX) = 3.465V,
VOUT(MIN) = 2.450V and
IQ(MAX) = 150µA,
Thus PD(MAX) = 0.508W.
Using this figure, and assuming TA(MAX) = 70°C, we can
calculate the maximum thermal impedance allowable to
maintain TJ 150°C:
( ) ( ) R = TH(JA)(MAX)
TJ(MAX) TA(MAX)
PD(MAX )
=
150 70
0.508
= 157°C / W
Noise immunity - in very electrically noisy environments,
it is recommended that 0.1µF ceramic capacitors be
placed from IN to GND and OUT to GND as close to the
device pins as possible.
This should be achievable with the SOT-23-5 package
using pcb copper area to aid in conducting the heat away
from the device. Internal ground/power planes and air
flow will also assist in removing heat.
External voltage selection resistors - the use of 1%
resistors, and designing for a current flow 10µA is
recommended to ensure a well regulated output (thus
R2 120k).
2006 Semtech Corp.
6
www.semtech.com

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