RPM871-H12 データシートの表示（PDF） - ROHM Semiconductor
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RPM871-H12 Datasheet PDF : 8 Pages
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Photo Link Module
RPM871-H12
zNotes
1) LEDVCC (8pin) and VCC (3pin)
• Other power source can be used difference between LEDVCC and VCC.
2) Caution in designing board lay-out
To get maximum potential from RPM871-H12, please keep in mind following instruction.
• The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H12 pin lead. Better not to
be close to photo diode side (1pin).
⇒This is to minimize feedback supplied to photo diode from RXD.
• As for C1 between 3-4 pin should be placed close to RPM871-H12.
• Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts which
generates noise, such as DC / DC converter.
3) Others
• Please be sure to set up the TXD (7pin) input to be “L” (under 0.55V) except transmitting data
(for < 90µs, on duty < 20%).
• Power down current might increase if exposed by strong light (ex. direct sunlight) at powerdown mode.
• Please use by the signal format which is specified by IrDA Ver1.2 (2.4k to 115.2kbps). There might be on error if used
by different signal format.
4) LED current derating and ambient temperature
The relation between LED peak current and maximum ambient temperature is shown below.
We recommend you to use within the range as indicated in below.
a) When glass-epoxy board (70×70×1.6mm) mounted.
250
Duty=10%
200
150
Duty=20%
100
50
0
−20 0
20 40 60 80 100
AMBIENT TEMPERATURE : Ta (°C)
b) RPM871-H12
250
200
Duty=10%
150
Duty=20%
100
50
0
−20 0
20 40 60 80 100
AMBIENT TEMPERATURE : Ta (°C)
6/7
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