PM4318-BI データシートの表示（PDF） - PMC-Sierra

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PM4318-BI

OCTAL E1/T1/J1 LINE INTERFACE DEVICE

PMC-Sierra 

PRELIMINARY

DATASHEET

PMC- 2001578

ISSUE 3

PM4318 OCTLIU

OCTAL E1/T1/J1 LINE INTERFACE DEVICE

18

ORDERING AND THERMAL INFORMATION

Table 59 – Ordering Information

Part No.

PM4318-BI

Description

288-pin Tape Super Ball Grid Array (TSBGA)

Table 60 – OCTLIU Theta Jc

PART NO.

PM4318-BI

CASE TEMPERATURE

-40°C to +85°C

Theta Jc

1.0 °C/W

Table 61 – OCTLIU Junction Temperature

PM4318-BI

Maximum Junction Temperature for Long Term Reliability

110 °C

Table 62 – OCTLIU Theta Ja vs. Airflow

Forced Air (Linear Feet per Minute)

Part No.

Case

Temperature

Theta J-A at

2.5 Watts

Conv 100 200 300 400 500

PM4318-BI -40°C to 85°C

Dense Board1

JEDEC Board2

32.8

13.7

30.1 28.3 27.2 26.7 26.5

12.0 10.8 10.0 9.4

9.0

1. – Dense Board is defined as a 3S3P board and consists of a 3x3 array of PM4318-BI devices

located as close to each other as board design rules allow. All PM4318-BI devices are assumed

to be dissipating maximum power. Theta J-A listed is for the device in the middle of the array.

2. – JEDEC Board Theta J-A is the measured value for a single thermal device in the same

package on a 2S2P board following EIA/JESD 51-3.

PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE

232

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