MC74HC589AFELG_13 データシートの表示（PDF） - ON Semiconductor

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MC74HC589AFELG_13

8-Bit Serial or Parallel-Input/Serial-Output Shift Register with 3-State Output

ON Semiconductor 

MC74HC589A

PACKAGE DIMENSIONS

PDIP−16

CASE 648−08

ISSUE U

SCALE 1:1

D

16

A

9

E

H

E1

1

NOTE 8

8

b2

TOP VIEW

e/2

c

B

END VIEW

WITH LEADS CONSTRAINED

NOTE 5

A2

A

NOTE 3

L

A1

D1

C

SEATING

PLANE

M

e

16X b

eB

END VIEW

SIDE VIEW

0.010 M C A M B M

NOTE 6

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-

AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.

4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH

OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE

NOT TO EXCEED 0.10 INCH.

5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM

PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR

TO DATUM C.

6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE

LEADS UNCONSTRAINED.

7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE

LEADS, WHERE THE LEADS EXIT THE BODY.

8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE

CORNERS).

INCHES

DIM MIN MAX

A −−−− 0.210

A1 0.015 −−−−

A2 0.115 0.195

b 0.014 0.022

b2 0.060 TYP

C 0.008 0.014

D 0.735 0.775

D1 0.005 −−−−

E 0.300 0.325

E1 0.240 0.280

e 0.100 BSC

eB −−−− 0.430

L 0.115 0.150

M −−−− 10 °

MILLIMETERS

MIN MAX

−−− 5.33

0.38 −−−

2.92 4.95

0.35 0.56

1.52 TYP

0.20 0.36

18.67 19.69

0.13 −−−

7.62 8.26

6.10 7.11

2.54 BSC

−−− 10.92

2.92 3.81

−−− 10 °

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