CXA1875AM データシートの表示（PDF） - Sony Semiconductor

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CXA1875AM

8-bit D/A Converter Compatible with I2C Bus

Sony Semiconductor 

Package Outline Unit : mm

CXA1875AP

16PIN DIP (PLASTIC)

+ 0.4

19.2 – 0.1

16

9

1

8

2.54

0° to 15°

CXA1875AP/AM

CXA1875AM

0.5 ± 0.1

1.2 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-16P-01

DIP016-P-0300

Similar to MO-001-AE

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

SOLDER PLATING

COPPER ALLOY

1.0 g

16PIN SOP (PLASTIC)

+ 0.4

9.9 – 0.1

16

9

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

8

1.27

+ 0.1

0.2 – 0.05

0.24 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-16P-L01

SOP016-P-0300

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

0.2g

Purchase of Sony’s I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C

system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.

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